EMI reduction on high-speed PCB using electromagnetic bandgap structure

The need for high-speed printed circuit board design whilst maintaining signal integrity and EMC standards have increased over the years in the modern integrated circuitry field. The use of electromagnetic bandgap structures (EBGs) have been demonstrated to provide excellent reduction of electromagnetic interference (EMI). In this study, a three by three planar of spiral, with and without patch were designed, simulated and fabricated on a low-cost FR4 substrate with permittivity of 4.3 and thickness of 1.6 mm. The designs of spiral EBGs with and without patch have the dimensions of 36 mm x 36 mm covering 9 unit cells. The performance of the designed EBGs were simulated and measured experimentally, and it was found to be in acceptable agreement. It was found that the spiral EBG without patch experienced a bandgap that covers from 4.5 to 6.3 GHz by using a dispersion diagram. Conversely, the bandgap for the spiral EBG with patch structure was found to be from 4.5 to 7.8 GHz with wider bandwidth. Owing to the desirable results demonstrated by the spiral EBG design with patch, it was then integrated into the high-speed circuit design to suppress the EMI emitted by the board. In this work, two low and three high-speed PCB designs were fabricated to track the desired EMI levels above 4.5 GHz. The third design of the high-speed PCB emitted the highest radiation emission (4.54 GHz) was selected for integration. The spiral EBG with patch structure successfully suppressed the EMI that occur at 4.54 GHz. Its effectiveness further suggests that the proposed EBG spiral with patch structure design is appropriate for EMI suppression that may occur from 4.5 to 7.8 GHz

Novel Spiral With and Without Patch EBG Structures for EMI Reduction

Electromagnetic bandgap structures (EBGs) have the ability to provide excellent reduction of electromagnetic interference (EMI). In this work, a 3 by 3 spiral with and without patch electromagnetic bandgap planar was fabricated on low cost FR4 substrate with permittivity of 4.3 and thickness of 1.6mm. Both designs have dimensions of 36 mm x 36 mm covering 9 unit cells planar design. The simulation and experimental characteristics are illustrated in this paper. An acceptable agreement between the simulated and measured results was obtained. It was found that the spiral without patch EBG experienced better bandgap than the spiral with patch design, which covered bandgap of (5.8 – 7.4 GHz) with relative bandwidth of 22.56%. Meanwhile, for the spiral with patch structure, it covered C band (4.5 – 7 GHz) with extended relative bandwidth of 43%. The results of the characteristics demonstrate that the proposed EBGs are attractive candidates for the integration into the high speed circuitry designs where spiral with patch can be involved in C band applications to suppress the EMI emitted by their circuitry

Novel spiral with and without patch EBG structures for EMI reduction

Electromagnetic bandgap structures (EBGs) have the ability to provide excellent reduction of electromagnetic interference (EMI). In this work, a 3 by 3 spiral with and without patch electromagnetic bandgap planar was fabricated on low cost FR4 substrate with permittivity of 4.3 and thickness of 1.6mm. Both designs have dimensions of 36 mm x 36 mm covering 9 unit cells planar design. The simulation and experimental characteristics are illustrated in this paper. An acceptable agreement between the simulated and measured results was obtained. It was found that the spiral without patch EBG experienced better bandgap than the spiral with patch design, which covered bandgap of (5.8 – 7.4 GHz) with relative bandwidth of 22.56%. Meanwhile, for the spiral with patch structure, it covered C band (4.5 – 7 GHz) with extended relative bandwidth of 43%. The results of the characteristics demonstrate that the proposed EBGs are attractive candidates for the integration into the high speed circuitry designs where spiral with patch can be involved in C band applications to suppress the EMI emitted by their circuitry